To download the latest issue
Nov 17th, 2010
NeoPac unveils 8-inch Silicon Wafer-level-packaging technology for HB-LED illumination
NeoPac Opto, Inc. a Taiwan based technology-driven LEDs lighting company recently announced its newly developed technology on 8 inches silicon-based wafer level package (WLP) for LEDs illumination, which is derived from its patented NeoPac Universal Platform (NUP) and LEDs Standard Light Sources.
This 8 inches semiconductor manufacturing process is for NeoPac’s unique ultra-high-power, multi-chip-module, single-packaged and point-like-source LEDs, or the so-called NeoPac Emitter. By coupling NeoPac Emitter together with its patented, highly effective micro heat pipe based heat-dissipation mechanism, a sustainable LEDs standard light source, so-called NeoPac Light Engine is available for LEDs general lighting. The integrated ultra high brightness NeoPac Light Engine is actually made by a system-in-package (SIP) approach.
Each NeoPac Emitter can emit maintained lumen at 1,000 lm. Most importantly, the standard light source will suitably fit any secondary optics design for a variety of LEDs illumination applications that owing to the intrinsic merits of the lighting characteristic of point-like-source. Furthermore, the effective Useful Life (L70) of such a light engine can sustain much longer than 60,000 hours. By this new WLP manufacturing technology, it’s possible to deliver at the amount of higher than 500,000 maintained lumen on a single 8 inches silicon wafer. According to NeoPac’s sustainable technology roadmap and LEDs chips’ lumen efficacy improvement, it’s estimated that the package on the same 8 inches silicon wafer can deliver total maintained lumen output up to one million (1 M) lumen in 2 years later. This technology is about to enable the mass-production of LEDs lighting, which can substantially reduce the manufacturing cost in quantity.
More ADVANCED PACKAGING news