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Feb 16th, 2011
 
Texas Instruments DLP announces optimized chipsets to enable brighter images using less power for mobile and embedded pico projector users
 
Driving forward the image quality of mobile pico projectors, Texas Instruments (TI) (NYSE:TXN) DLP is revealing optimized DLP Pico chipsets at Mobile World Congress 2011
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The chipsets are designed to enhance image brightness without increasing power usage for both WVGA (native DVD resolution) devices, such as mobile phones, and VGA devices, such as digital cameras and camcorders. 

TI DLP's Pico chip technology is already being adopted in the mobile sector via the first Android powered smartphone featuring a fully integrated DLP Pico projector.  Able to project an image up to 50" on any surface in optimum lighting conditions, the tiny projection chip requires very little space and is virtually undetected in the device's overall form factor. With advancements in size and performance, the TI DLP Pico chipset continues to enable the most compelling big picture experiences with contemporary handsets. 

"Pico projectors have already started to have a positive impact on users of mobile products," said Frank Moizio, Manager, DLP Pico Projection.  "With business and consumer mobile phone users increasingly accessing the Internet via smartphones and sharing growing amounts of multimedia content with colleagues and friends, pico projectors embedded into mobile devices are the perfect way to elevate those experiences. Integrated projectors using these new chipsets are the next step to making those experiences even more compelling, engaging, and hassle free, all from the palm of your hand." 

TI DLP Pico chipsets enable multimedia content to be displayed brighter than ever before, and with power-optimized lower voltage technology, battery consumption is kept to a minimum.  Along with integration with the TI Analog ASIC - PAD 1000, these chipsets will enable a lower bill of material cost, smaller engine form factors and lower power requirements.

The specifications for the two chipsets are as follows:

VGA

    * 4x3 aspect ratio
    * Compatible with digital camera and camcorder formats
    * Increased power efficiency due to lower voltage process technology enabling maximum brightness in embedded devices
    * Height optimized for the most contemporary form factors
    * 640x480 resolution

WVGA

    * 16x9 aspect ratio
    * Compatible with preferred display formats for mobile phones
    * Increased power efficiency due to lower voltage process technology enabling maximum brightness in embedded devices
    * Height optimized for the most contemporary form factors
    * 854x480 resolution
 
The latest DLP Pico chipsets can be found at the heart of a growing number of all-new product types. To experience firsthand the full breadth of new and upcoming products equipped with Texas Instruments DLP Pico technology, along with other DLP innovations, be sure to check us out at stand 8A84 (Hall 8) at Mobile World Congress.


 
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