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> Powdec announces breakthrough Gallium Nitride transistor de...
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Mar 29th, 2011
Powdec announces breakthrough Gallium Nitride transistor design
Dramatically reduces power losses, increases break-down voltage, eliminates current collapse.
Powdec K.K. announced that, together with Sheffield University, they have succeeded in developing breakthrough high voltage Gallium Nitride (GaN) power transistors. This was realized by creating semiconductor hetero-junction structures based on novel principles, which solve the problems of conventional transistors and dramatically improve the transistor performance. In the transistors, current collapse is almost completely eliminated, power losses are reduced and high break-down voltages of more than 1,100 Volts (V) are realized. These new GaN transistors are suited to be used in a broad range of equipment from inverters in consumer appliances to server power supplies, electric vehicles and industrial motors to lower power use. Gallium Nitride is a next generation semiconductor that enables power devices to have lower power losses and higher energy efficiency compared to present silicon devices. Together with Powdec’s previously announced GaN diodes, these GaN transistors will be core devices enabling an energy efficient, green future. Powdec solved the difficult issue of realizing a high hole density in collaboration with University of Sheffield. This allowed a 2 dimensional hole gas of high hole density, 1.3 x 1013/cm2, to be achieved for the first time in the world. Fig 2. Comparison of current collapse showing virtually zero current collapse for Powdec’s new HFET Going forward, Powdec’s breakthrough HFET technology can be easily combined with ‘normally-off’ structures. Powdec plans to shift growth of the devices to large diameter silicon wafers, with aims to have these energy efficient, high voltage products shipping in volume in 2 to 3 years. To accelerate the market adoption of these innovative, low-power GaN devices, Powdec is actively expanding its partnerships worldwide. Sources :
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