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Apr 7th, 2011
 
UMC buys equipment for 3D IC manufacturing
 
According to Digitimes, United Microelectronics Corporation (UMC) has acquired NT$561 million (US$19 million) worth of production equipment for through silicon via (TSV) and other 3D IC technologies for image sensor components and memory chips, according to a company filing with the Taiwan Stock Exchange (TSE).
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UMC previously revealed that it plans to absorb the 73%-owned subsidiary, which will liquidate, due to cost and other concerns, according a TSE filing issued in February.

In mid-2010, UMC announced that it has forged a three-way tie for the development of 3D IC integration solutions with chip supplier Elpida Memory and Powertech Technology (PTI), which provides assembly and testing services.
UMC CEO Shih-Wei Sun was quoted in previous reports saying the company expects to start sampling integrated 3D IC solutions using 28nm process technology in mid-2011, with volume production slated for 2012.


 
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