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Apr 17th, 2012
ChipMOS to expand its 12’’ gold bumping capacity for LCD driver IC assembly and test
ChipMOS Technologies, A Taiwan-based provider of IC packaging and testing services, is expanding its 12-inch-wafer gold bumping capacity for packaging and testing LCD driver ICs, according to the company.
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ChipMOS has set aside a 2012 capex budget of NT$2 billion (US$67.8 million), with 70% of which is to be used in gold bumping process for LCD driver IC packaging and testing and 30% in copper-wire bonding process, wafer-level packaging and testing equipment, the company indicated. ChipMOS aims to reach gold bumping capacity of 16,000 12-inch wafers and copper-nickel-gold bumping capacity of 8,000 12-inch wafers a month in 2012, the company said.

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