To download the latest issue
Apr 17th, 2012
Let’s rally around 3D chip standards
A new interesting article from Mark LaPedus discussing 2.5D/3D IC standardization and test.
The IC industry must embrace — and become more active — in the standards process to help jumpstart the 2.5D/3D chip era, according to a panel at the recent Mentor Graphics User Group Meeting in Santa Clara, Calif.
More ADVANCED PACKAGING news