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Apr 17th, 2012
 
Letís rally around 3D chip standards
 
A new interesting article from Mark LaPedus discussing 2.5D/3D IC standardization and test.
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The IC industry must embrace — and become more active — in the standards process to help jumpstart the 2.5D/3D chip era, according to a panel at the recent Mentor Graphics User Group Meeting in Santa Clara, Calif.
 
One of the members of the panel also challenged conventional wisdom, saying that 2.5D devices based on interposers could be more difficult to develop than true stacked 3D chips. If anything, 2.5D chips might be more difficult to devise and commercialize, according to one panelist.
 
To read the complete article, please click here.

 

 
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