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May 2nd, 2012
Cisco wants 2.5D/3D chips sooner than later
Amid the industry’s insatiable thirst for more bandwidth, Cisco Systems Inc. said that it wants 2.5D/3D stacked devices sooner than later and is getting “impatient” regarding the overall progress of the technology.
Only a smattering of 2.5D/3D chips have been announced and shipped in the market today. Despite the hype for the technology in recent years, most experts believe that 2.5D/3D chips will not ship in volumes until 2014 or so.
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