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Sep 14th, 2012
 
The 9th international conference: 3-D Architectures for Semiconductor Integration and Packaging
 
December 12-14, 2012 Sofitel San Francisco Bay Hotel
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The 9th international conference, 3-D Architectures for Semiconductor Integration and Packaging, brings together technology and business leaders from around the world to take a look at the technology and market landscape for emerging 3-D device and systems integration and interconnect. Today, questions around 3-D solutions increasingly focus on when, not if, the industry will see product introduction and high volume manufacturing. Products based on 3-D chip scale packaging have already made significant inroads, in particular for image sensors, and 2.5-D devices with interposers, e.g. in FPGAs, are also seeing market introduction, and very healthy market growth for such uses is widely anticipated.

However, many industry participants are targeting applications in memory and logic devices/systems as the major market opportunity over the next several years. Once established, 3-D chips will then change the semiconductor industry paradigm for many years to come, enabling yet higher performance, lower cost, and smaller sizes. A spectrum of industrial and consumer applications are waiting, and it seems likely that significant yet unforeseen applications will emerge as well. Various 3-D technology approaches are converging, and the industry and supply chain is evolving in ways that are under much discussion. The next couple years, 2013 and 2014, are viewed by many as key to the evolution of the industry. For those that succeed, double digit growth or more will be the prize.

This meeting is firmly established as a leading industry event in 3-D integration and packaging and serves the needs of the entire 3-D ecosystem, providing exceptional opportunities to network with, and learn from, other senior-level technology and business leaders. The format of the conference and its presentations enables speakers to present the most up-to-date and forthright perspectives possible. The conference offers a unique opportunity to gain the latest technology and market insights on emerging and on-going 3-D integration and packaging efforts, as well as on technology and industry trends in this dynamic arena.

With Speakers from:
 
Altera
Amkor Technology
Applied Materials
Cadence Design Systems
CEA-Leti
Chinese Academy of Sciences – IME
Ericsson
EV Group
Fraunhofer IZM-ASSID
GLOBALFOUNDRIES
IMEC
Institute of Microelectronics
Microelectronic Consultants of NC
Micron Technology
Oracle
Qualcomm
R3Logic
RTI International
SEMATECH/SK Hynix
ST-Ericsson
SUSS MicroTec
Swiss Federal Institute of Technology
Synopsys
TechSearch International
Tezzaron Semiconductor
Tokyo Electron America
Xilinx
Yole Développement
Ziptronix

Mark your calendar and make plans to attend....
Visit http://techventure.rti.org/ for more details. Take advantage of early bird rates and corporate team discounts and register today.

 


 
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