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Nov 9th, 2012
Deca Technologies unveils its new Fan-in WLCSP package type with adaptive patterning(TM)
Deca Technologies, an electronic interconnect solutions provider to the semiconductor industry, today announced the introduction of the new M-Series(TM) CSP product line featuring Adaptive Patterning(TM).
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M-Series is a rugged, fully molded packaging technology that provides popular ball grid array (BGA) style formats while eliminating the need for laminate substrates. Adaptive Patterning is a technology that dynamically creates and implements a unique design for each device during the manufacturing process to adapt for the typical die shift associated with embedded device packaging.

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