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Nov 14th, 2012
Fairchild Semiconductor's Silicon Carbide (SiC) solution is available for sample
SiC bipolar junction transistors (BJTs), first in the product portfolio, offer lowest total power losses at high operation temperatures.
In an effort to achieve higher power density, and to meet strict efficiency regulations and system up-time requirements, industrial and power electronic designers are challenged with constantly reducing power losses and improving reliability in their designs. However, improving these critical design capabilities in applications like renewable energy, industrial motor drives, high-density power supplies, automotive, and down-hole can complicate a design as well as drive overall system costs higher.
Advanced technologies that simplify engineering challenges with functional integration and design support resources that minimize components while reducing engineering time.
Meeting the needs of device manufacturers and chipset suppliers by integrating leading device technologies into smaller advanced packages that offer size, cost and power advantages.
Among the first products to be released in Fairchild's SiC portfolio is a family of advanced SiC bipolar junction transistors (BJTs) that offer high efficiency, high-current density, robustness, and easy high-temperature operation. By leveraging exceptionally efficient transistors, Fairchild's SiC BJTs enable higher switching frequencies due to lower conduction and switching losses (ranging from 30-50 percent) that provide up to 40 percent higher output power in the same system form factor.
Fairchild, as part of a complete silicon carbide solution, also has developed “plug-n-play” discrete driver boards (a 15A and 50A version) that, when used in conjunction with Fairchild's advanced SiC BJTs, not only provide increased switching speeds for reduced switching losses and better reliability, but also allow designers to easily implement SiC technology into their applications. Application notes, which provide designers the additional support necessary to design with SiC devices, and reference designs that allow for the development of driver boards to meet specific application needs, are also available from Fairchild and are intended to reduce design time and shorten time-to-market. SiC BJT vs. Other SiC.
Robust and Reliable
Packaging and Pricing Information (in US 1,000 quantity pieces)
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