To download the latest issue
Nov 27th, 2012
Deca Technologies: A Closer Look
A year ago Deca Technologies, a subsidiary of Cypress Semiconductor, announced its wafer level processes and the first technology application WLP amid great fanfare but with little exposure of the technology involved.
Earlier this month Deca announced their M-Series platform of embedded die (FOWLP) packaging as the second major product offering. This time they are releasing significantly more information about their process.
At the recent IWLPC meeting Chris Scanlan, VP of product management gave a presentation entitled “Adaptive Patterning for Panelized Packaging” which described a lot of what they are doing.
Die embedded in a panel are not perfectly aligned. Current fan out WLP processes suffer from both pick-and-place positional accuracy and shrinkage after curing of the mold compound. Die position accuracy of < 10μm and rotational accuracy of < 0.1 deg are typically required which in turn requires slow pick and place speed. Prior solutions have had significant limitations.
Previous solutions for die alignment issues in embedded packaging
Deca’s proprietary solution is what they call “Adaptive Patterning”, a design and patterning process that allows features such as vias and redistribution traces to dynamically align to shifting die within an embedded device structure. Die are placed onto a carrier and molded into a 300 mm wafer (panels in the future). Since the die are supplied with copper studs (i.e copper pillar bumps) the die end up embedded front and back with molding compound. Wafers are then removed from the carrier and planarized to reveal the copper studs. The wafer is imaged and the position of each die is imported into the proprietary software. They claim this results in < 30 sec design time per wafer.
Adaptive patterning process flow
Very little has been disclosed about the subsequent lithography. Boyd Rogers, VP of R&D, indicates that there are no traditional glass masks involved which certainly helps explain their claimed fast turn around time. Outsiders have surmised that some sort of laser exposure is involved, but that remains proprietary.
Adaptive traces (green) added to RDL Design
Deca sees their technology being extendable to multi-die as well as embedded die in PCB.
More ADVANCED PACKAGING news