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“Innovative technologies introduction impacts favorably the LED packaging materials market”, says Yole Développement

The LED packaging industry is moving toward further cost reduction and new technologies including Flip Chip and Chip Scale Package (CSP), says Yole Développement (Yole) in its latest report on packaging for LED: LED Packaging Technology and Market Trends 2014. These market and technology trends directly impact the LED & advanced packaging industry and its supply chain, especially at the material and equipment levels: whereas the equipment market enters in an infernal cycle, the materials market for LED packaging confirms its growth…

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Alpha to address low-temperature assembly of LED packages on flexible substrates at SMTAI

Somerset, NJ -- Alpha, the world leader in the production of electronic soldering and bonding materials in collaboration with Multek, a global supplier of rigid and flexible printed circuits, will present a technical paper on mid-power LED package assembly on PET substrates, at the upcoming 2014 SMTAI show to be held in Rosemont, Illinois.

Read more: Alpha to address low-temperature assembly of LED packages on flexible substrates at SMTAI

Philips Lumileds redefines an entire category with the launch of the matrix platform

Philips Lumileds delivers infinitely configurable LED boards, linear flex and modules using the industry’s most comprehensive line of application-optimized LEDs.

Read more: Philips Lumileds redefines an entire category with the launch of the matrix platform

Viking Tech develops thin-film metallized substrate for heat dissipation in high-power packaged LEDs

Viking Tech uses advanced thin film process technology to develop thermal dissipation for high power LED packages. Our metallized ceramic substrate has excellent thermal dissipation, low thermal expansion coefficient and outstanding stability. Metallized ceramic substrate improves performance and reliability compared to traditional MCPCB substrate.

Read more: Viking Tech develops thin-film metallized substrate for heat dissipation in high-power packaged LEDs

ETI over reliant on government subsidies

lec-Tech International (ETI) financial performance and management condition has come under the spotlight, as the company’s conflict between NVC Lighting intensifies.

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Veeco's EPIK700 MOCVD system achieves high yields and productivity to lower LED manufacturing costs

Veeco Instruments Inc. (Nasdaq: VECO) introduced the new TurboDisc® EPIK700™ Gallium Nitride (GaN) Metal Organic Chemical Vapor Deposition (MOCVD) system that combines the industry's highest productivity and best-in-class yields with low cost of operation, further enabling lower manufacturing costs for light emitting diodes (LEDs) for general lighting applications.

Read more: Veeco's EPIK700 MOCVD system achieves high yields and productivity to lower LED manufacturing costs

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