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Everlight Electronics presents new low/mid and high-power LEDs

Everlight Electronics Co., Ltd. (TSE:2393), a leading player in the global LED and optoelectronics industry, introduces two new low/mid-power LEDs especially suited for use in light tubes – retrofits and new designs – with excellent lm/w and lm/price characteristics.

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Plessey expands with chip scale packages and wafer level packaging

Plessey announced its expansion into Chip Scale Packages and Wafer Level Packaging solutions leading to its Application Specific LED - the AS-LED™. Recent performance improvements have elevated Plessey's award winning GaN-on-Silicon technology MaGIC™ LEDs to be competitive with any LED technology with improvements in key critical areas including lumens/watt, elevating GaN-on-Silicon above existing LED technology.

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Remtec expands LED packaging capabilities

Remtec Inc., the leading manufacturer of substrates and packages using PCTF® (Plated Copper On Thick Film) metallization, has expanded its LED substrate and submount design and manufacturing capabilities by adding new features such as bond-pad down (flip-chip) packaging with a cathode-anode gap as small as 75-50 µm and selective gold-tin plating. As a result, Remtec can now produce higher performance, lower cost metallized LED substrates and submounts using added benefits, each custom tailored to a specific customer requirement matching the required performance and power level or assembly methods.

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AIX R6 sets new standards in LED manufacturing

AIXTRON, a worldwide leading provider of deposition equipment to the semiconductor industry, presented its next generation MOCVD system at the China SSL international trade fair. The new AIX R6 has been designed for the production of LEDs based on Gallium Nitride (GaN) and can be delivered in 12x6-, 31x4-, 121x2-inch wafer configurations. Equipped with numerous technical innovations the new tool will lower operational costs significantly while simplifying usability and process control.

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LG to quadruple OLED panel production in December

LG Display, the display-making affiliate of LG Electronics, is on track to ramp up production of OLED panels in December.

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Taiyo Nippon Sanso to install GaN MOCVD system at Epistar corporation

Taiyo Nippon Sanso will install its mass-production GaN MOCVD system UR25K (6 inch X 7 wafers) into Epistar for development of light emitting diodes grown on 6 inch sapphire substrates.

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