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Fairchild FIS1100 6-Axis MEMS IMU
Sep.2015

fairchild_fis1100_icon
2 990 €

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Description

fairchild FIS1100 flyerFairchild’s first consumer IMU manufactured using a completely new bulk micro machining process and interconnection structure.

Fairchild enters the market of combo sensors, and particularly 6-axis IMU, with its first consumer IMU bundled with Fairchild's high-performance 9-axis sensor fusion algorithms, XKF3™, and on-chip AttitudeEngine™ motion processor.

Fairchild is presenting a product completely different than other devices on the market, from size, manufacturing process and cost point of view.

Fairchild proposes a 3.3x3.3x1mm device, a footprint increased by 18% when compared with the latest STMicroelectronics and Bosch 6-axis IMU.
The device presents one ASIC and one MEMS die stacked on 2 layers PCB and connected by wire bonding. The electrical connections in the MEMS structure are performed by TSV which allows a better utilization of the space and a larger gyroscope and accelerometer areas.
On the process side, new techniques has been introduced in the MEMS fabrication. The MEMS die is manufactured by bulk micromachining on three wafers bonded together by eutectic and direct bonding.

fairchild FIS1100 image
The FIS1100 targets wearable sensors for sports, fitness, and health; pedestrian navigation; autonomous robots; and virtual and augmented reality.
The report includes a detailed technology and cost comparison with ST’s new generation LSM6DS3 and with leading edge 6-Axis IMUs from Bosch Sensortec (BMI160) and InvenSense (MPU-6500).

COMPLETE TEARDOWN WITH:

  •  Detailed Photos
  • Precise Measurements
  • Material Analysis
  • Manufacturing Process Flow
  • Supply Chain Evaluation
  • Manufacturing Cost Analysis
  • Selling Price Estimation
  • Comparison of Fairchild FIS1100 vs ST LSM6DS3 & Bosch BMI160 & InvenSense MPU-6500

 

Table of contents

Overview / Introduction


 

Physical Analysis


  • Physical Analysis Methodology
  • Package

> Package Characteristics Marking & Pin-out

> Package Opening & Wire Bonding Process 

> Package Cross-Section

  • ASIC Die

> View, Dimensions & Marking

> Delayering & Main Blocks Identification

Process Identification
Cross-Section

  • MEMS Die

> View, Dimensions & Marking

> Bond Pad Opening & Bond Pads Details

> Cap Removed & Cap Details

> Sensing Areas Details
> Cross-Section (Sensor, Cap & Sealing)
> Process Characteristics
> Fairchild Patents

 

Technology comparison with STMicroelectronics LSM6DS0, Bosch Sensortec BMI160 and InvenSense MPU-6500



Manufacturing Process Flow


  • Global Overview
  • ASIC Front-End Process
  • MEMS Process Flow
  • Wafer Fabrication Units
  • Packaging Process Flow & Assembly Unit

Cost Analysis


  • Yields Hypotheses
  • ASIC Front-End Cost
  • ASIC Back-End : Probe Test & Dicing Cost
  • ASIC Wafer & Die Cost
  • MEMS Front-End Cost
  • MEMS Front-End Cost per process steps
  • MEMS Back-End : Probe Test & Dicing Cost
  • MEMS Wafer & Die Cost
  • Back-End : Packaging Cost
  • Back-End : Final Test & Calibration Cost
  • FIS1100 Component Cost

Price Analysis


  • Fairchild Financial Results
  • FIS1100 Selling Price Estimation

Cost & Price comparison with ST, Bosch Sensortec and InvenSense 6-Axis IMUs

 

 

System Plus Consulting


Across the Enterprise, from marketing to purchasing and R&D, product manufacturing cost is a major factor which has to be measured and then optimized. Since 1993, System Plus Consulting’s mission has been to develop and sell the right tools and services to meet these costing requirements.

System Plus Consulting utilizes an engineering approach to cost. Cost models and technology expertise are combined to provide customers with an accurate and objective estimation of manufacturing costs and selling prices.

Headquartered in Nantes, France, System Plus Consulting is specialized in technology and cost analysis of electronic components and systems. During our 20 years in business, we have built and refined detailed cost models as the primary tools for hundreds of analyses. The highly qualified System Plus cost engineers combine broad and deep skills in semiconductor and electronics technologies with years of experience in cost modeling.

We offer:
− Custom reverse costing analyses: technology analysis followed by cost evaluation
− Standard reverse costing reports: regular publications on innovative products (available from our catalogue)
− Costing tools: software tools combining models and data to perform cost analysis

System Plus Consulting analyzes any type of electronic devices and systems, with a special focus on semiconductor technologies. Major fields of technology and cost expertise are:
− Integrated Circuits
− Power Devices and Modules
− MEMS & Sensors
− Photonics: LED, Image Sensors
− Packaging including wafer level
− Electronic Boards and Systems

Our analyses are used by Purchasing Departments to measure their suppliers’ cost structure, R&D Departments to confirm technological choices depending on their impact on costs, and Benchmarking/Marketing Departments to monitor the products on the market.

System Plus Consulting is committed to provide a high level of service:
− Delivery of reports and custom analyses with a minimum lead time.
− Results presentation and online Q&A sessions when support is needed.
− Open methodology and full confidentiality in order to maintain a trustful collaboration.

Since 2008, our partnership with YOLE Développement has allowed us to stay at the forefront of technologies and has added a market view to our reports.

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