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May 10th, 2012
 
2.5D Interposer and 3DIC seen as innovation enabler!
 
The ASIC business is getting more and more complicated. The ability to produce innovative die at a competitive price to solve increasingly complex problems just isn’t enough. The technology required to package that die is now front and center.
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Fig 1: 2.5D Interposer and 3DIC concepts.
Fig 1: 2.5D Interposer and 3DIC concepts.

Here, at the junction of advanced design, process technology and state-of-the art packaging is where real innovation takes place. Perhaps nowhere does the importance of advanced packing technology, such as System in Package (SIP) and emerging 2.5D and 3D capabilities, become clearer than when you talk with the team at Global Unichip Corporation (GUC) who is emerging as a leader in the newly defined “Flexible ASIC” space.

Fig 1: 2.5D Interposer and 3DIC concepts (Courtesy of Global Unichip Corporation).

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