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Jul 17th, 2012
2.5D Interposers, 3DIC & MEMS Packaging seen as key areas for upcoming ITRS update
At SEMICON West 2012, in San Francisco, CA, the working groups of the International Technology Roadmap for Semiconductors (ITRS) held 3 sessions (TechXPOTs) outlining 2012 updates to the roadmap.
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The ITRS undergoes major revisions on odd-numbered years. 2012 being an even-numbered year, very little change occurred to the Overall Roadmap Technology Characteristics (ORTC). However, within the working groups, some updates were worth noting.

Full article here.


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