Home  >  ADVANCED PACKAGING  > 2.5D Interposers, 3DIC & MEMS Packaging seen as key areas ...
Jul 17th, 2012
2.5D Interposers, 3DIC & MEMS Packaging seen as key areas for upcoming ITRS update
At SEMICON West 2012, in San Francisco, CA, the working groups of the International Technology Roadmap for Semiconductors (ITRS) held 3 sessions (TechXPOTs) outlining 2012 updates to the roadmap.
Send to a friend

The ITRS undergoes major revisions on odd-numbered years. 2012 being an even-numbered year, very little change occurred to the Overall Roadmap Technology Characteristics (ORTC). However, within the working groups, some updates were worth noting.

Full article here.


Jul 31st
Jul 30th
Jul 29th
Jul 23rd
Jul 22nd
©2007 Yole Developpement All rights reserved                  Disclaimer | Legal notice | To advertise
Yole Développement: Le Quartz, 75 cours Emile Zola, 69100 Villeurbanne, France. TEL: (33) 472 83 01 80 FAX: (33) 472 83 01 83 E-Mail: info @yole.fr