NANIUM, a global leader in 300mm wafer-level packaging, today announced that it has shipped its 200 millionth eWLB component for wireless communications and other applications.
“This milestone, which we have reached in less than two years, demonstrates that eWLB technology is a robust low-cost solution delivering both high reliability and high yields for manufacturing advanced electronic products with high I/O density in a small form-factor,” said Armando Tavares, president of NANIUM’s executive board. “It also signals NANIUM’s success at implementing our growth strategy of introducing the technology into new markets where we can serve a wider range of applications and customers.”
The 300mm embedded wafer-level ball grid array technology (eWLB) uses a combination of traditional front-end and back-end semiconductor manufacturing techniques with parallelprocessing of all the chips on the wafer, leading to more cost-effective manufacturing. With an increased level of integration of the silicon’s overall protective package and a dramatically higher number of I/Os per area, this technology provides significant cost and size benefits for manufacturers of cutting-edge wireless and consumer products.
NANIUM has recently adapted its eWLB technology for consumer MEMS, stacked die DRAM multichip packages (MCP) for high-capacity memory applications, mixed-signal RF ASIC with high power dissipation, and heterogeneous integration within System-in-Package (SiP).
The 10 percent year-over-year productivity increase also reflects full conversion to NANIUM’s eWLB overmold technology that allows both thinner and more robust packages. NANIUM was one of the first semiconductor companies to build volume capacity for 300mm eWLB wafers, completing the ramp up in late 2010.
Come and meet NANIUM in the Silicon Saxony pavilion at SEMICON Europa, October 9-11, 2012: Hall 2, Booth 2.050.