3D IC is expected to afford business opportunities for Taiwan-based makers of semiconductor production equipment because processes and corresponding equipment for 3D ICs have not yet been standardized and therefore Taiwan-based makers can cooperate with foundry services providers in R&D for 3D IC equipment, according to chairman Hsu Chin-jung for Taiwan-based Hermes Microvision a maker of E(electronic)-beam inspection systems.

International vendors, including KLA, ASML, Applied Materials and Tokyo Electron, have dominated the supply of semiconductor equipment in Taiwan, with Taiwan-based makers occupying only 10% of the market, Hsu noted.

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