webleads-tracker

Home  >  ADVANCED PACKAGING  > 3D IC commercialization to take place in 2015-16, says ASE...
  >  ADVANCED PACKAGING
Sep 7th, 2012
 
3D IC commercialization to take place in 2015-16, says ASE
 
The adoption and commercialization of 3D TSV stacking IC technology and products will likely take place in the 2015-16 timeframe, according to Tong Ho-ming, general manager and chief of R&D at Advanced Semiconductor Engineering (ASE).
Send to a friend

As for 2.5D TSV chips, they could be widely found in end products in 2014-15, said Tong.

Full text here.


 
More ADVANCED PACKAGING news

Jul 30th
Jul 29th
Jul 23rd
Jul 22nd
Jul 21st
 
©2007 Yole Developpement All rights reserved                  Disclaimer | Legal notice | To advertise
Yole Développement: Le Quartz, 75 cours Emile Zola, 69100 Villeurbanne, France. TEL: (33) 472 83 01 80 FAX: (33) 472 83 01 83 E-Mail: info @yole.fr