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Sep 7th, 2012
3D IC commercialization to take place in 2015-16, says ASE
The adoption and commercialization of 3D TSV stacking IC technology and products will likely take place in the 2015-16 timeframe, according to Tong Ho-ming, general manager and chief of R&D at Advanced Semiconductor Engineering (ASE).
As for 2.5D TSV chips, they could be widely found in end products in 2014-15, said Tong.
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