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Jul 19th, 2012
3D TSV chip market will grow more than 10 times faster than the global semiconductor industry according to Yole Développement
3DIC & TSV Interconnects 2012 Business Update, a report from Yole Développement.
Yole Développement announces its 3DIC & TSV Interconnects 2012 Business Update report. In this report, Yole Développement provides an update of the 3DIC & TSV technology market. Yole Développement’s analysts define the market forecast for the next 5 years and provide deeper understanding of supply chain challenges and moves that are currently happening in this fascinating “middle-end” industry space.
3D TSV chips will represent 9% of the total semiconductors value in 2017.
“Last year, the market value of all the devices using TSV packaged in 3D in the 3DIC or 3D-WLCSP platforms (CMOS image sensors, Ambient light sensors, Power Amplifiers, RF and inertial MEMS) was worth $2.7B. It will represent 9% of the total semiconductor value by 2017, hitting almost $40B,” explains Lionel Cadix, Market & Technology Analyst, Advanced Packaging at Yole Développement. 3DIC which typically uses TSV ‘via middle’ for memory and logic IC stacking is expected to grow the fastest in wafers as well as in overall value, whereas 3D WLCSP will continue growing at a 18% CAGR.
3D WLCSP: the most mature 3D TSV platform
Most of the players provide 3D WLCSP services based on a 200mm wafer-level-packaging industrial infrastructure. Important investments are still expected from major companies to move to 300mm. Indeed, this trend will be necessary to move to the high-end CMOS image sensors market (> 8MPx resolution) where sensors are today on the transition from backside illumination to real 3DIC packaging architecture. This latest architecture will be soon called « 3D BSI », where photodiodes will be vertically stacked directly onto the DSP / ROIC wafer and connected by the mean of TSVs.
Future 3DIC market driven by stacked memories & logic SOC
However, we may need to wait until 2014-2015 before seeing any significant volume adoption of the ‘wide IO interface’ concept with TSV in a 28nm application processor chip for mobile / tablet applications. Indeed, given the complexity of the supply chain settlement to successfully deliver real products to the market in such high volumes and complex technology node, it is expected that some level of industry consolidation is needed to gather the front-end, middle-end to back-end assembly & test operations under the umbrella of one unique, single player entity. Wafer foundry giants Samsung and TSMC are clearly catching-up with this vertical integration trend to meet with the demand from leading fabless companies such as Qualcomm, Broadcom, Marvell, nVidia and Apple, but also with fab-light IC companies TI, STMicro and NEC / Renesas.
A true battle is happening in the middle-end area!
“The outlook is looking bright for the future ‘virtual IDM’ models that will expand into the 3DIC chip business: Yole Développement team estimates that the global 3D TSV semiconductors packaging, assembly and test market will reach the $8B business value by 2017,” adds Jean-Marc Yannou, Senior Analyst, Advanced Packaging at Yole Développement. About $3.8B of this business will be related to the middle-end wafer processing activity such as TSV etching filling, wiring, bumping, wafer testing and wafer-level assembly. Meanwhile, the back-end operations related to the assembly and test of such complex 3DIC modules will reach an impressive market value of $4.6B, representing a clear opportunity for sustainable grow in this “2.0” advanced packaging industry.
More information on the report here.
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