Introduced at the end of 2010, VTI new consumer gyro targeting mobile phones and gaming devices is now in volume production. Whereas the gyroscope consumer market is strongly dominated by 5 players (InvenSense, Epson Toyocom, STMicroelectronics, Panasonic and Sony), only 2 of them (InvenSense and STM) have released an integrated 3-axis sensor. However VTI Technologies is also playing a signifi cant part in this expanding market.

VTI CMR3000
Featuring a 4.1x3.1x0.83mm size, the CMR3000 becomes the smallest 3-axis gyroscope. These small footprint and height are obtained by using of a wafer-level packaging approach.

MEMS manufacturing
The MEMS gyroscope is manufactured using three bonded Silicon wafers. The two fi rst wafers are used to build the sensor elements (seismic mass, capacitive combs…). Indeed, the sensor elements are patterned by DRIE on a c-SOI substrate (fusion bonding of two silicon wafers one of which contains buried cavities). The third wafer (the cap wafer) allows sealing hermetically the sensor elements. It is realized with a silicon wafer where via and cavities
are etched by DRIE and fi lled with borosilicate glass. The glass allows to insulate silicon contacts with the
sensor and to seal hermetically the component with an anodic bonding process.

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