Home  >  ADVANCED PACKAGING  > New 3D hybrid SSD architecture with TSV features much higher...
Jun 18th, 2012
New 3D hybrid SSD architecture with TSV features much higher specs than SSDs
A Japanese research group developed a hybrid SSD architecture using ReRAM (resistive random-access memory), which realizes high speed data rewriting, and a high capacity NAND flash memory.
Send to a friend

The group is led by Ken Takeuchi, professor at the Department of Electrical, Electronic and Communication Engineering, the Faculty of Science and Engineering, Chuo University.

Compared with existing SSDs using only NAND flash memory, it can realize an 11 times higher data writing performance,

Full text here.


Sep 17th
Sep 11th
Sep 11th
Sep 11th
Sep 11th
©2007 Yole Developpement All rights reserved                  Disclaimer | Legal notice | To advertise
Yole Développement: Le Quartz, 75 cours Emile Zola, 69100 Villeurbanne, France. TEL: (33) 472 83 01 80 FAX: (33) 472 83 01 83 E-Mail: info @yole.fr