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Apr 7th, 2014
3D power packaging: A closer look
In late 2013 the PSMA (Power Sources Manufacturers Association) commissioned Tyndall National Institute to determine the impact of 3D packaging on power supply development. Brian Narveson recently presented their results at the IEEE Applied Power Electronics Conference (APEC) in Dallas and i-Micronews thought it was worth… A closer look.
In late 2013 the PSMA (Power Sources Manufacturers Association) commissioned Tyndall National Institute to determine the impact of 3D packaging on power supply development. Brian Narveson recently presented their results at the IEEE Applied Power Electronics Conference (APEC) in Dallas. They define 3D Power packaging similarly to what we would call 3D packaging, i.e. embedded die or stacked die/packages:
3D Power Packaging as defined by the PSMA
Their interview of suppliers showed the following ranges would be needed for the following applications. Respondents focused on power supplies now being shipped or in development. There are no stars in the 1kW column for servers since this need is met by multiple units.
Applications driving the need for power packaging
Wide Bandgap devices with high switching frequency need very low parasitics which can be met by 3D packaging technology.
Chip Scale 3D Packaging
Examples of 3D chip scale packaging
PCB Scale 3D products (i.e. SiP)
High voltage / current power modules
Embedding and Sintering are the most widely used 3D Packaging Technologies for high voltage/current applications. Both can be used to eliminate conventional wire bonding for high current interconnect of both passives (including connectors and heatsinks) and actives. Both reduce parasitics, improve thermal performance and enhance reliability.
Sintering can be used to replace conventional soldering by placing a conductive paste between the two surfaces to be connected and applying temperature and pressure to make a mechanical and electrical connection at temperatures below the melt point of the paste. It provides a reliable mechanical interconnect with lower inductance, IR losses and thermal resistance than wire bonds. Sintering can be used for passive and active components, rigid and flexible pcb’s, metal contacts and heat sinks. Sintering is now being used in production volumes.
Brian Narveson, Garry Tomlins, Ernie Parker and Cian Ó'Mathúna at APEC
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