webleads-tracker

Home  >  ADVANCED PACKAGING  > 3D power packaging: A closer look...
  >  ADVANCED PACKAGING
Apr 7th, 2014
 
3D power packaging: A closer look
 
In late 2013 the PSMA (Power Sources Manufacturers Association) commissioned Tyndall National Institute to determine the impact of 3D packaging on power supply development. Brian Narveson recently presented their results at the IEEE Applied Power Electronics Conference (APEC) in Dallas and i-Micronews thought it was worth… A closer look.
Send to a friend

In late 2013 the PSMA (Power Sources Manufacturers Association) commissioned Tyndall National Institute to determine the impact of 3D packaging on power supply development. Brian Narveson recently presented their results at the IEEE Applied Power Electronics Conference (APEC) in Dallas. They define 3D Power packaging similarly to what we would call 3D packaging, i.e. embedded die or stacked die/packages:
- Power supply products derived from the use of the z axis
- Incorporation of a variety of technologies to reduce footprint
 - Solutions that increase power density (W/cm3)

3D Power Packaging as defined by the PSMA

Their interview of suppliers showed the following ranges would be needed for the following applications. Respondents focused on power supplies now being shipped or in development.  There are no stars in the 1kW column for servers since this need is met by multiple units.

Applications driving the need for power packaging

Wide Bandgap devices with high switching frequency need very low parasitics which can be met by 3D packaging technology.

Chip Scale 3D Packaging
For chip scale packaging they felt the most significant advances would come from:
- Semiconductor packages with 3D lead frames
- Packages including the inductive and capacitive components
- Integration of inductors in silicon (like Intel’s Haswell)
- Embedding of actives and passives in the substrate
Examples of such devices are shown below. Embedded chip scale components are in volume production at TI and AT&S 

Examples of 3D chip scale packaging


PCB scale 3D packaging
What they are calling PCB scale we would call multichip modules or SiP. Basically they are larger laminate substrates that can be through hole or SMT devices that can be overmolded. Embedded passives including magnetics is being considered for higher power PCB scale products. 

PCB Scale 3D products (i.e. SiP)

High voltage / current power modules
High voltage/current power modules include:
- Industrial and Transportation Controllers
- Power Inverters
- IGBT Modules
- Motor Drives
- Harsh environment modules ( high voltage, high current, high temperature, vibration etc.)

Embedding and Sintering are the most widely used 3D Packaging Technologies for high voltage/current applications. Both can be used to eliminate conventional wire bonding for high current interconnect of both passives (including connectors and heatsinks) and actives. Both reduce parasitics, improve thermal performance and enhance reliability.

Sintering can be used to replace conventional soldering by placing a conductive paste between the two surfaces to be connected and applying temperature and pressure to make a mechanical and electrical connection at temperatures below the melt point of the paste. It provides a reliable mechanical interconnect with lower inductance, IR losses and thermal resistance than wire bonds. Sintering can be used for passive and active components, rigid and flexible pcb’s, metal contacts and heat sinks. Sintering is now being used in production volumes.

Sintering interconnect

Brian Narveson, Garry Tomlins, Ernie Parker and Cian Ó'Mathúna at APEC

 

 
More ADVANCED PACKAGING news

Sep 17th
Sep 11th
Sep 11th
Sep 11th
Sep 11th
 
©2007 Yole Developpement All rights reserved                  Disclaimer | Legal notice | To advertise
Yole Développement: Le Quartz, 75 cours Emile Zola, 69100 Villeurbanne, France. TEL: (33) 472 83 01 80 FAX: (33) 472 83 01 83 E-Mail: info @yole.fr