I-Micronews - ADVANCED PACKAGING: 3D IC, WLP & TSV BUSINESS/MARKET: 3DIC 2010 Munich - Call for Abstracts

> ADVANCED PACKAGING: 3D IC, WLP & TSV BUSINESS/MARKET

Jul 15th, 2010

3DIC 2010 Munich - Call for Abstracts - DEADLINE EXTENDED TO JULY 15th - Contribute NOW!

The IEEE International 3D System Integration Conference (3DIC) will be held at the "Fraunhofer Haus" in Munich in November 16-18, 2010.

This conference combines the previous ASET and IEEE EDS Society sponsored International 3D System Integration Conference, held in Tokyo in 2007 & 2008 and the Fraunhofer and IEEE CPMT sponsored International 3D System Integration Workshop held in 2003 & 2007 in Munich. After the first combined conference in San Francisco 2009, the 2nd IEEE 3D System Integration Conference will be held in Munich in 2010, rotate to Tokyo in 2011 and then rotate back to San Francisco in 2012.

3DIC 2010 will cover all 3D integration topics, including 3D process technology, materials, equipment, circuits technology, design methodology and applications. The conference invites authors and attendees to submit and interact with 3D researchers from all around the world. Papers are solicited in subject topics, including, but not limited to, the following:

- 3D Integration Technology. Through Silicon Vias (TSV), wafer thinning, wafer alignment, wafer bonding, wafer dicing, 3D IC process, monolithic 3D integration, heterogeneous 3D integration (e.g. for MEMS, NEMS), capacitive coupling, inductive coupling, multilevel epitaxial growth, etc.

- 3D IC Circuits Technology. 3D SOC, 3D Memory, 3D Processor, 3D DSP, 3D FPGA, 3D RF and microwave/millimeter wave, 3D analog circuits, 3D biomedical circuits etc.

- 3D Applications - imaging, memory, processors, communications, networking, wireless, biomedical, MEMS/NEMS etc.

- 3D Design Methodology. 3D CAD, 3D synthesis, 3D design flows, Signal and power integrity analysis and design in 3D, 3D thermal design and analysis, test and design for test; 3D mechanical stress and reliability design and analysis, etc.

Presentation abstracts and proposals for panels and tutorials should be submitted on the conference web site: www.3dic-conf.org . New deadline for papers and proposals is July 15st, 2010. Abstracts are to be 500 words in length. Accepted papers will be due September 15th, 2010.

Email Subscription

To receive future notices about this meeting, please send an email to subscribe@3dic-conf-munich.org

The content of the email should be subscribe 3dic-conf email where “email” is your email address.

Sponsoring Organizations :

IEEE CPMT Society

ASET (Associate of Super Advanced Electronics Technologies, Japan)

Sponsoring Institutions:

Fraunhofer EMFT (formerly IZM-M) IMEC

Tohoku Univ North Carolina State Univ

2010 Conference Co-Chairs: P. Ramm (Fraunhofer EMFT), E. Beyne (IMEC)

Organizing Committee

Europe: Co-Chairs: Peter Ramm (Fraunhofer EMFT - Munich), Eric Beyne (IMEC)