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Oct 1st, 2013
 
3S to start shipping MEMS microphone chips to Taiwan handset ODMs in 1Q14
 
IC design house Solid State System (3S) with its MEMS microphone chips has entered the supply chain of Taiwan's major handset ODMs, with shipments to kick off in the first quarter of 2014, according to industry sources.
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3S' MEMS microphone chips have also been adopted by China's smartphone brands for entry-level and mid-range models, said the sources. 3S is expected to enjoy substantial growth in shipments of its MEMS microphone chips in the first quarter of 2014, the sources indicated.

3S uses United Microelectronics' (UMC) CMOS process and Powertech Technology's (PTI) flip-chip (FC) packaging services to manufacture its MEMS microphone chips. Yield rates of 3S' MEMS microphone chips have now improved to more than 90%, the sources revealed.

3S has been shipping its MEMS microphone chips mainly to headphone module manufacturers since 2013, the sources added. Shipments for smartphone applications in the first quarter of 2014 are set to buoy significantly the company's overall sales generated from its MEMS microphone product line, the sources noted.

To read more, please visit www.difitimes.com website.


 
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