Organized by IMAPS France, the event will feature 20 papers from leaders in the field along with a tabletop exhibition.  Over 120 delegates are expected to attend.  The topics to be addressed include:

- Chip-level, board-level and system-level thermal management
- Package platforms and architectures for power semiconductors
- Thermal modelling and simulation
- Heatsinks, heatpipes and other cooling products
- Liquid and phase change cooling
- New cooling solutions
- Thermal management of opto-electronic components

Do not miss this opportunity to learn from and network with the European and international community of thermal management of electronic systems!

Click here to download the advanced program and registration form, or contact Florence Vireton at +33 (0)1 39 67 17 73 email: imaps.france@imapsfrance.org

IMAPS France also announces a call for papers for the 2nd annual Micro/Nan-Electrics Package and Assembly Design and Manufacturing Forum (MiNaPaD) and exhibition to be held at the Minatech site in Grenoble on April 25-26, 2012. 
Further information about IMAP France and our events may be found on our website: http://france.imapseurope.org/

IMAPS is a non-profit organization to promote microelectronics, electrical interconnection and packaging industries as well as high level academic research.

The IMAPS France chapter organizes year round technical conferences and workshops on these subjects Wafer Level Packaging, Embedded Die and 3D Packaging, Power Electronics, Cables and Connectors