The Workshop will present improvements in thermal management materials, components and systems, to provide
innovative packaging and cooling solutions for highly integrated power, RF, microwave and other devices and subsystems.

Increases in functionality, complexity, miniaturisation, operating temperature and power output will require advances
in thermal solutions at many levels, for military, aerospace, consumer and industrial systems.
Industry transition to SiC and GaN devices allows higher operating temperatures with higher heat flux but also
greater reliability; these trends also require improvements and changes in packaging and thermal materials.
Thermal management has been clearly identified, in industry technology roadmaps worldwide, as a crucial constraint
in packaging at all levels.

To get the complete program of the workshop, please click here.

The 7th annual “European Advanced Technology Workshop on Micropackaging and Thermal Management” will be held in La Rochelle on February 1-2, 2012