To download the latest issue
Sep 3rd, 2012
A*STAR and Huawei announce joint effort to develop 2.5D interposer technology
A*STAR Institute of Microelectronics (IME) and Futurewei Technologies, Inc., a subsidiary of Huawei Technologies Co., Ltd. (Huawei), have signed a Memorandum Of Understanding (MOU) to develop and advance Through Silicon Interposer (TSI) technology. The two organizations will collaborate on advanced packaging with TSI, 2.5D/3D IC research and development, and demonstrate heterogeneous 2.5D design and manufacturing flow.
Under this agreement, Huawei will join the TSI Consortium led by IME to optimise TSI technology for cost effective and performance-driven applications. IME’s capabilities in 300mm 3D-TSV/2.5D-TSI technologies and advanced packaging and integration will play a key role in enabling Huawei to develop the next-generation portfolio of networking and computing infrastructure solutions
More ADVANCED PACKAGING news