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Sep 3rd, 2012
A*STAR and Huawei announce joint effort to develop 2.5D interposer technology
A*STAR Institute of Microelectronics (IME) and Futurewei Technologies, Inc., a subsidiary of Huawei Technologies Co., Ltd. (Huawei), have signed a Memorandum Of Understanding (MOU) to develop and advance Through Silicon Interposer (TSI) technology. The two organizations will collaborate on advanced packaging with TSI, 2.5D/3D IC research and development, and demonstrate heterogeneous 2.5D design and manufacturing flow.
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Under this agreement, Huawei will join the TSI Consortium led by IME to optimise TSI technology for cost effective and performance-driven applications. IME’s capabilities in 300mm 3D-TSV/2.5D-TSI technologies and advanced packaging and integration will play a key role in enabling Huawei to develop the next-generation portfolio of networking and computing infrastructure solutions

“Collaboration with Huawei, an industry leader in networking systems, underscores an important milestone for our 2.5D/3D IC R&D roadmap,” said Prof. Dim-Lee Kwong, Executive Director of IME. “Having strategic partners in the upcoming TSI Consortium will accelerate the realization of high performance 2.5D/3D ICs.”

"IME’s commitment to drive the realisation of 3D IC and their deep R&D capabilities make them a strong partner to help Huawei advance in this area," said John Roese, Senior Vice President and General Manager, Huawei North America R&D. "We are very excited about the long-term potential of both the technology and the collaboration."


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