A*STAR Institute of Microelectronics (IME) and Futurewei Technologies, Inc., a subsidiary of Huawei Technologies Co., Ltd. (Huawei), have signed a Memorandum Of Understanding (MOU) to develop and advance Through Silicon Interposer (TSI) technology. The two organizations will collaborate on advanced packaging with TSI, 2.5D/3D IC research and development, and demonstrate heterogeneous 2.5D design and manufacturing flow.

Under this agreement, Huawei will join the TSI Consortium led by IME to optimise TSI technology for cost effective and performance-driven applications. IME’s capabilities in 300mm 3D-TSV/2.5D-TSI technologies and advanced packaging and integration will play a key role in enabling Huawei to develop the next-generation portfolio of networking and computing infrastructure solutions


“Collaboration with Huawei, an industry leader in networking systems, underscores an important milestone for our 2.5D/3D IC R&D roadmap,” said Prof. Dim-Lee Kwong, Executive Director of IME. “Having strategic partners in the upcoming TSI Consortium will accelerate the realization of high performance 2.5D/3D ICs.”

"IME’s commitment to drive the realisation of 3D IC and their deep R&D capabilities make them a strong partner to help Huawei advance in this area," said John Roese, Senior Vice President and General Manager, Huawei North America R&D. "We are very excited about the long-term potential of both the technology and the collaboration."