webleads-tracker

Home  >  ADVANCED PACKAGING  > A*STAR Institute of Microelectronics and SEMI jointly ...
  >  ADVANCED PACKAGING
Apr 3rd, 2014
 
A*STAR Institute of Microelectronics and SEMI jointly present forums at SEMICON Singapore
 
Forums to be hold at SEMICON Singapore from April 23 to April 25, 2014.
Send to a friend

2.5D / 3D IC Forum: interposers and 3D solutions for cost-effective heterogeneous integration
In the past few years, advances in Silicon fabrication, Assembly, Packaging technologies have driven the realization of products using 2.5D, 3D IC technology.  Companies in logic, memory and imaging space are designing and manufacturing products using 2.5D, 3D IC technology.   The next phase in the path to high volume manufacturing is the optimization of cost-effective approaches to heterogeneous integration.  Interconnect design, fabrication, assembly and packaging of 2.5D/3D ICs need to be optimized to be cost effective for the end applications.   Such optimization for 2.5D/3D ICs involves the entire supply chain from system architects to materials developers.  That is the focus of this year’s 2.5D/3D ICs forum.

For the industry to successfully adapt to the performance and cost demands of 2.5D/3D ICs, anticipate and address challenges encountered in high volume manufacturing, this forum brings together leading Industry/Market Analysts, System manufacturers, Fabless companies, University, IDM, Foundry, OSAT, Equipment manufacturers and Materials companies to share their knowledge and insights.

Hear from industry leaders, distinguished academia and research institute including:
A*STAR Institute of Microelectronics, Atotech Deutschland GmbH , EV Group, Fujitsu Laboratories Ltd., GLOBALFOUNDRIES U.S. Inc., IBM Systems & Technology Group, Invensas Corporation, LAM Research, NANIUM S.A. Portugal, SPTS Technologies Ltd, STATS ChipPAC Ltd., TechSearch International, Inc., Tohoku University, Tokyo Electron Ltd., Yole Développement.

2.5D / 3D IC Forum
24 April 2014
9:30 am to 5:20 pm
Tech West, Marina Bay Sands Expo, Singapore


MEMS Technology Forum
Riding on the mega trend of mobility, the inertial sensors are seeing their boom days ahead. Cost and performance will drive the future inertial sensor developments. They are likely achieved through monolithic integration and component level performance improvement.

SEMICON 2014 addresses these challenges faced by inertial sensors by bringing in the world-leading gurus and industrial technology leaders in MEMS sensors, sensor fusion, monolithic sensor-ASIC integration, and inertial sensor application development.  The conference paves the road for (industrial relevant /the commercially impactful), monolithically integrated 9 DOF MEMS inertial sensor; and point directions for future inertial MEMS technologies.

Hear from industry leaders, distinguished academia and research institute including:
A*STAR Institute of Microelectronics, Advantest Corporation, ASE, Bosch Sensortec, EV Group, Globalfoundries, National Taiwan University, Polytec GmbH, SoftMEMS EURL, University of Tokyo and Yole Développement.

MEMS Technology Forum
25 April 2014
9:30 am to 3:30 pm
Tech East, Marina Bay Sands Expo, Singapore


 
More ADVANCED PACKAGING news

Jul 31st
Jul 30th
Jul 29th
Jul 23rd
Jul 22nd
 
©2007 Yole Developpement All rights reserved                  Disclaimer | Legal notice | To advertise
Yole Développement: Le Quartz, 75 cours Emile Zola, 69100 Villeurbanne, France. TEL: (33) 472 83 01 80 FAX: (33) 472 83 01 83 E-Mail: info @yole.fr