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Feb 24th, 2014
ALSI becomes ASM Laser Separation International
ASM Laser Separation International (ALSI) B.V. (“ASM ALSI”) announces that it will continue the business of Advanced Laser Separation International (ALSI) N.V. (“ALSI”) in Beuningen with immediate effect.
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ASM ALSI intends to continue the business of ALSI as presently conducted including relationships with key customers, suppliers and other business partners. ASM ALSI is a wholly owned subsidiary of ASM Pacific Technology Ltd (“ASMPT”), which is listed on the Hong Kong Stock Exchange and is the world's largest assembly and packaging equipment supplier for the semiconductor and LED industries, and the world’s third largest SMT equipment supplier. As a subsidiary of the ASMPT group, ASM ALSI brings both the financial and technological strength to the business of ALSI that it needs to move to the next phase of expansion and development.

Mr. Richard Boulanger will continue as the managing director of ASM ALSI and all key employees of ALSI have expressed their commitment to continue their employment with ASM ALSI.

Customers, suppliers and other business partners of ALSI will be informed shortly in more detail.

We are very pleased to have ASM ALSI as a part of ASMPT. The multi-beam laser technology developed by ALSI offers customers unparalleled value. With the strong sales and service network of ASMPT, we can help to bring unique value to many customers at much faster pace”, commented Mr. WK Lee, CEO of ASMPT.

Mr. Richard Boulanger also commented that, “We are excited to be part of the ASMPT organization. We believe that ASMPT’s excellent reputation and Global Sales and Service network will accelerate our Market Penetration especially for the Grooving Market as well as our other established markets. It will also increase our level of commitment and support to our customers. ”

ALSI introduced the Multi Beam Laser Technology and has developed unique processes for dicing GaAs, Transistors and Diodes, High and Ultra High Brightness LED’s. It has now introduced the very competitive Matrix Grooving Process for the IC Market.

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