Through-Silicon-Via (TSV) 3D IC technology is used to interconnect stacked wafers in FPGAs and memory chips.
AMS is using this technology to its ambient light sensor devices and is planning to develop more highly integrated and smaller devices for the smartphone and cameras market.
Austrian chip maker ams is applying through-silicon via (TSV) 3D IC fabrication technology to its ambient light sensor devices.
TSV technology is being used to interconnect stacked wafers in FPGAs and memory chips and ams believes it can apply the technology to analogue sensors to very small wafer scale packages.
“We have been developing the TSV capability and expect to be in production with first sensors in the middle of the year,” said Thomas Riener, senior v-p marketing communications at ams.
The company is planning to develop more highly integrated and smaller ambient light sensors for use in smartphones and cameras.
After the acquisition of US-based light sensor firm TAOS in 2011, supplying sensors to smartphone manufacturers has become an important business for the Graz-based manufacturer.
“We have 40% market share in ambient light sensors in smartphones, “claimed Riener.
Higher current capability is becoming important as smartphones move to higher resolution displays with higher power budgets.
The AS3729 regulator contains NMOS and PMOS FETs for each of two phases, which can be controlled separately and can handle an output current of 2.5A.