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Apr 7th, 2014
 
ASE, Inotera reportedly to set up 3D IC packaging joint venture
 
Advanced Semiconductor Engineering (ASE) reportedly plans to team up with Inotera Memories to set up a joint venture for handling TSV (through-silicon via) 3D IC packaging.
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Advanced Semiconductor Engineering (ASE) reportedly plans to team up with Inotera Memories to set up a joint venture for handling TSV (through-silicon via) 3D IC packaging.

ASE and Inotera have been in talks for over a year and are expected to finalize the deal soon, said the sources, adding that the joint venture is likely to be set up either at a Inotera's idle plant or at a ASE plant in Chungli, north Taiwan.

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