To download the latest issue
Apr 3rd, 2012
ASE plans to invest nearly 1 Billion $ to build 2 new fabs in Taiwan for assembly and test services
Advanced Semiconductor Engineering Inc plans to spend NT$28.2 billion (US$955.87 million) to build two factories in Greater Kaohsiung and one research and development building to meet growing customer demand for smartphones, tablets and game consoles, the Ministry of Economic Affairs said.
ASE, the world’s biggest chip packager, said it plans to build six plants within the next five years, including the ones already under construction, to expand its global market share to 25 percent, the ministry said in a statement released on Friday.
The expansion also allows Kaohsiung-based ASE to seize more business opportunities from increasing outsourcing from chip companies, the ministry said.
Full text here.
More ADVANCED PACKAGING news