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| February 11th - 10:39 AM |
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RSS FEEDS
Japan has been funding 3D IC R&D since the inception of the first ASET project in 1999. The current Dream Chip project started in 1998. Research funding for 2009/2010 is 3.4 billion yen. 17 companies (shown below) are providing 97 researchers to work on this program.
- Device Manufacturers: Elpida, Toshiba, Renesas, Rohm
- Electronics Equipment Manufacturers: Fujitsu, Hitachi, IBM Japan, NEC, Panasonic, Sharp, NAC Image Technology
- Materials & System Manufacturers: Advantest, Ibiden, Shinko, Tokyo Electron, Toppan Printing, Yamaichi Electronics
Dream Chip program goals include:
- Design environment technology
- Interposer technology
- Chip test technology
- Cooling & stacking/bonding technology
- Thin wafer technology
- Demonstration devices - design & development
- Architecture and design technology for reconfigurable devices
- 3D integration technology for reconfigurable devices
- Multi-band variable RF MEMS device technology
- Multi-band communication front end circuit
Potential Dream Chip application areas include healthcare, advanced consumer electronics, automobile auto-pilot and high speed communications.
The ASET roadamp shows stacked DRAM in 2012-2013 and 3D applied to high speed communication devices and high performance image processing device a few years later. The first demonstration device (below) is memory on logic mated on a Si TSV interposer which is scheduled for delivery in 2012.
The second demonstration device will be a high speed image processing system. Requirements for this device include:
- Ultra high speed image data output (more than 10,000 frames/sec)
- Multiple parallel one screen (frame) image process
- High speed pipeline process within image process block from image sensor layer to procesor calculation circuitry layer
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