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May 11th, 2012
About half of the polymeric materials demand is driven by dielectric passivation resins
“Polymeric Materials for 3DIC & WLP Applications”, a new report from Yole Développement.
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Yole Développement announces its report “Polymeric Materials for 3DIC & WLP Applications”. This report provides a complete analysis of the opportunities for Polymeric Materials in 3DIC & Wafer-Level Packaging applications.

Polymer usage will grow by 26% CAGR in wafer level applications over 5 years
Polymeric semiconductor material market reached a value of $274M last year and its growth over the next 5 years of more than 26% CAGR will be fueled by the expansion of flip-chip wafer bumping, Fan-in WLCSP packages, 3D WLP, FO WLP packages, 2.5D Glass / Silicon interposers and 3DIC  packages.
Yole Développement analysts have gathered market data, technology information and analysis necessary to answer the following questions:
o What materials are being used in what applications?
o What key properties do I need to understand before I make a material choice?
o Who are the key suppliers of these materials and what is their market share?
o What synergies do competitors have in their product lines?

An increasing number of polymers are used for WLP applications
About half of the demand today for polymeric materials in 3DIC & WLP applications is driven by dielectric passivation resins which reached about $107M market value in 2011,” explains Phil Garrou, Senior Consultant, Advanced Packaging at Yole Développement.
Polymide (PI) and BCB of DOW Chemical still account for >70% of the total demand, historically by the growth of flip-chip bumping and WLCSP passivation steps.

PBO, epoxies, WPR and AL-X recently entered the market thanks to the growing demand in 300mm WLCSP, FOWLP and emerging 3DIC applications.
This research will cover :
o Global materials market forecast
o Global forecast  breakdown by application
o Global forecast  breakdown by function
o Detailed market breakdown of permanent dielectrics by material, supplier, account

A wide range of polymeric materials are used to solve WLP issues
There is a wide range of polymeric material available on the market. This study will feature:
o Chemistries and history of key microelectronic polymers
o Properties, pros & cons for each solution
o Applications by polymer type
o Processing considerations

New functions of polymeric materials are leveraging burgeoning WLP market
Today demand is driven by FC wafer bumping, fan-in WLCSP and thin-film IPD. Tomorrow, significant demand will shift to FOWLP, 3DIC stacks, 3D WLP, and 2.5D interposer substrate platforms,” say Amandine Pizzagalli, Technology and Market Analyst, Advanced Packaging and Jérôme Baron, Business Unit Manager, Advanced Packaging at Yole Développement.

Types of polymeric materials covered:
o Permanent dielectric polymers
o Thick plating resists
o Temporary bonding & de-bonding adhesives
o Hard mask resist for DRIE etch
o Wafer-level underfills
o Wafer-level molding compounds
o Adhesive tape (BG/Dicing tape)

More information on this report here.



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