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Home  >  MEMS  >  TECHNO  > Air Products introduces xenon difluoride for etching applic...
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Jul 28th, 2010
 
Air Products introduces xenon difluoride for etching applications
 
High performing, highly selective etch material to initially target MEMS market
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Air Products announced the addition of xenon difluoride (XeF2) to its portfolio of electronic materials. XeF2 is used as an etching gas, primarily in the Micro Electro Mechanical Systems (MEMS) market. XeF2 provides manufacturers with a high selectivity to silicon versus SiO2 and other materials.

Air Products is uniquely positioned to serve the burgeoning XeF2 market thanks to its more than 35-year history of fluorine expertise and its access to affordable xenon on account of its large-scale air separation units and XeCovery™ xenon recovery system.

“Our XeCovery and XeF2 offerings are complementary and together offer customers a stable low-cost supply of XeF2,” said Tim Maykut, commercial development manager for Air Products. “Our experience in chemical synthesis has shown that the continuous, flow-through process we developed can deliver quality material at the high volumes needed to match the growth potential of the MEMS market.Additionally, our deep understanding of etching process applications and supply of other etch materials provides further value to any XeF2 user. Also, our packaging and delivery expertise support an easy integration of this material to customers’ equipment.”

Air Products has already built a pilot plant capable producing up to 300 kilograms per year, and this production technology can quickly be scaled to metric ton capacities.


 
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