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> Alchimer opens 300mm applications-and-development facility ...
> ADVANCED PACKAGING: 3D IC, WLP & TSV
Mar 9th, 2010
Alchimer opens 300mm applications-and-development facility in Asia
Alchimer S.A., a provider of nanometric deposition technology for semiconductor interconnects and through-silicon vias, said it has opened a new applications-and-development facility in Seoul, South Korea, for demonstration of its innovative processes on 300mm wafers. The facility will begin accepting customers’ wafers in April.
On-site Alchimer personnel will be able to provide full-stack demonstrations of Alchimer’s breakthrough technology, electrografting (eG™), which is an electrochemical process that enables the growth of extremely high quality polymer and metal thin films on both conducting and semiconducting surfaces. The company’s deposition technology reduces overall cost of ownership for high aspect ratio TSV metallization by up to two-thirds compared to conventional dry processes and shortens time to market. Sources :
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