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> ADVANCED PACKAGING: 3D IC, WLP & TSV
> Alchimer signs agreement with Korean supplier KPM Tech to ...
> ADVANCED PACKAGING: 3D IC, WLP & TSV
Feb 4th, 2010
Alchimer signs agreement with Korean supplier KPM Tech to supply total solution for 3D TSV plating
Alchimer signs far-reaching agreement with KPM Tech, a South Korean chemical and equipment manufacturer. The multi-level production collaboration includes wet processing tools and materials for Alchimer’s Through-Silicon Via (3D TSV) platform.
In a deal that will generate economical new process options for the 3D integration market, Alchimer S.A., a provider of nanometric deposition technology for semiconductor interconnects and through-silicon vias, and KPM Tech Co. Ltd., a manufacturer of plating materials and systems, today announced a multi-level collaboration that gives KPM Tech exclusive rights to produce chemicals in Korea for Alchimer’s technology. Sources :
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