Altatech, a subsidiary of Soitec, announced that it has installed and qualified an AltaCVD system at the Fraunhofer Research Institution for Modular Solid State Technology EMFT in Munich where it will be used to deposit poly-silicon films for CMOS and MEMS applications.
This repeat order from Fraunhofer EMFT reinforces the AltaCVD system’s leadership position in advanced material deposition for semiconductor applications.
The high-temperature CVD reactor system was qualified in November 2012 for the first set of applications, including thin-film deposition of doped and undoped poly-silicon. Currently, Fraunhofer EMFT is using the high-temperature CVD system to develop advanced deposition technologies for thin and thick poly-silicon layers. The AltaCVD system was selected for its ability to tightly control layer thicknesses, achieve precise doping levels, and perform highly efficiency cleaning system.
“The AltaCVD tool provides both the flexibility and the performance we need to conduct our various research projects in which we are using single-wafer deposition technology in a multi-chamber platform to develop process integration with high throughput and extremely low level of contamination,” said Prof. Ignaz Eisele, head of Fraunhofer’s Nano Materials and Silicon Technology Division.
“Our single wafer CVD system’s ability to deposit crystalline, polycrystalline and amorphous materials with extremely low defectivity and high uniformity of dopants and film thickness control are key to enabling thin- and thick-film deposition needed for semiconductor and MEMS applications,” said Jean-Luc Delcarri, general manager of Soitec’s Altatech Division. “Following the release of our advanced CVD systems for front-end and memory processing and the roll out of our deposition tools for TSV (through-silicon-via) isolation and conductive layers, we are now applying our proven technology in depositing poly-silicon layers for new applications.”
The versatile AltaCVD system is a multi-chamber tool designed for plasma-enhanced or high temperature CVD of advanced semiconductor materials using liquid or gaseous precursors.
Further developments are investigated to deposit thick poly-silicon materials while maintaining high deposition uniformity and low particle levels.
About Fraunhofer EMFT
The Fraunhofer Research Institution for Modular Solid State Technology EMFT in Munich conducts cutting-edge applied research and development in the field of sensors and actuators. One of the core competences of the research institution is development of silicon-based technologies, components and systems, including optimization of reliable microsystem components. The aim is to quickly and efficiently turn R&D results into applied processes and services, and to make these usable by industry. With its infrastructure and decades of experience, Fraunhofer EMFT is developing forward-looking solutions that have earned numerous international prizes and honors. Strategic partnerships and long-term cooperation with industry and universities around the world underscore the scientific excellence of the institute, which employs approximately 80 scientists, engineers and technicians working on scientific research projects as well as technology and process development, R&D projects for the industry, feasibility studies and consulting. Fraunhofer EMFT emerged as an independent research institution from the Munich branch of the Fraunhofer Institute for Reliability and Microintegration IZM on July 1, 2010.
About Altatech Technology and Equipment Expertise
The Altatech division offers a unique portfolio of equipment for mature and advanced materials deposition and holistic defect inspection. It develops highly efficient, cost-effective inspection and chemical vapor deposition (CVD) technologies used for R&D and manufacturing of semiconductors, LEDs, MEMS and photovoltaic devices. Altatech Semiconductor S.A. became a subsidiary of Soitec in January 2012.
Soitec is an international manufacturing company, a world leader in generating and manufacturing revolutionary semiconductor materials at the frontier of the most exciting energy and electronic challenges. Soitec’s products include substrates for microelectronics (most notably SOI: Silicon-on-Insulator) and concentrator photovoltaic systems (CPV). The company’s core technologies are Smart Cut™, Smart Stacking™ and Concentrix™, as well as expertise in epitaxy. Applications include consumer and mobile electronics, microelectronics-driven IT, telecommunications, automotive electronics, lighting products and large-scale solar power plants. Soitec has manufacturing plants and R&D centers in France, Singapore, Germany, and the United States. For more information, visit: www.soitec.com.