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Apr 2nd, 2012
 
Amkor licenses through mold via technology to Shinko for PoP and 3D packaging
 
Amkor Technology, Inc. a leading provider of semiconductor packaging and test services, today announced that it has granted SHINKO ELECTRIC INDUSTRIES CO., LTD. a non-exclusive license to its proprietary Through Mold Via (“TMV®”) technology.
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Through mold via package on package.
Through mold via package on package.

The agreement provides for the transfer of Amkor’s TMV® technology to SHINKO and a license under Amkor’s patents to enable SHINKO to manufacture packages based on this technology. The license also permits SHINKO to use Amkor’s registered TMV® trademark in its sales and marketing activities.

“Technology innovation has always been a key component of our success, and our proprietary TMV® technology has been widely adopted in the rapidly growing smartphone and tablet markets,” said Ken Joyce, Amkor’s president and chief executive officer. “We are pleased to license our TMV® technology to SHINKO, a respected outsourced assembly and test provider. This engagement will provide our customers the option of having multiple sources for TMV® packaging services.”

“This licensing agreement is significant for SHINKO,” said Fumio Kuraishi, SHINKO’s President and Representative Director. “The availability of Amkor’s innovative TMV® technology will provide SHINKO with a time-to-market advantage and enable us to provide our customers with state-of-the-art solutions for their 3D package stacking needs.”

Since their introduction, package-on-package (“PoP”) components have been rapidly adopted for 3D integration of logic and memory. Amkor’s TMV® technology enables leading-edge PoP designs for smartphone and tablet applications, delivering increased integration, miniaturization and performance without requiring the development of new surface mount stacking infrastructure or adding cost. Amkor’s TMV® technology improves warpage control, reduces package thickness, facilitates finer pitch memory interfaces, enables both wirebond and flip chip interconnects and supports stacked die or passive integration requirements.

 

 
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