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Home  >  ADVANCED PACKAGING: 3D IC, WLP & TSV  > Analog Devices introduces DC-DC Converter in a WLCSP packag...
  >  ADVANCED PACKAGING: 3D IC, WLP & TSV
Jun 15th, 2009
 
Analog Devices introduces DC-DC Converter in a WLCSP package
 
Balancing low operating input voltage capability, low quiescent current, and small size, the wafer level packaged (WLCSP) 3-MHz, 600-mA device offers designers more flexibility in meeting strict power and printed-circuit board (PCB) area budgets without increasing battery capacity
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5-Ball Wafer Level Chip Scale <br>Package [WLCSP] from Analog Devices
5-Ball Wafer Level Chip Scale
Package [WLCSP] from Analog Devices
The ADP2108 dc-dc converter from Analog Devices is designed to provide better energy efficiencies in battery-powered portable devices. This converter operates from a 2.3-V input voltage for excellent conversion efficiency, transient response, and protection, Analog Devices says. This low operating voltage enables designers to fully use the available battery energy for 2.5- and 3-V power loads before recharging, which can eliminate the requirement of a more expensive buck-boost regulator in some applications.

The ADP2108 is available in two package options. The 1- by 1.5- by 0.6-mm wafer-level chip-scale package (WLCSP) provides an ultra-low profile size for portable devices with stringent board space limitations, particularly on the z-axis.

Samples are available now in the five-ball WLCSP and five-lead TSOT-23 packages. Pricing is $0.80 each in 1000-unit quantities.
 

 
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