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May 10th, 2012
 
Apple A5X: leaving the PoP area?
 
Unlike the first two iPads, the 3rd generation iPad abandons the high density flip-chip PoP SoC/DRAM stack and uses a discrete, flip-chip BGA package for the SoC and two discrete BGA packages for the DRAMs.
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If you think of SoC silicon as a stack, the lowest layer is where you'll find the actual transistor logic, while the layers of metal above it connect everything together. In the old days, the silicon stack would sit just as I've described it—logic at the bottom, metal layers on top. Pads around the perimeter of the top of the silicon would connect to very thin wires, that would then route to the package substrate and eventually out to balls or pins on the underside of the package.

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