Aptos Technology, which specializes in backend services for the production of NAND flash chips and devices such as microSD cards, announced March 13 that two of its subsidiaries will merge and integrate their resources and technologies for efficiency reasons. The move will help Aptos expand its 12-inch wafer level packaging business, the company said.

ADL Engineering, which provides packaging and testing services for analog and logic ICs with customers mainly fabless companies, will merge with wafer-level packaging house Advanced Chip Engineering (ACE). ADL will be the surviving company, with the merger to be effective on April 22.

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