webleads-tracker

Home  >  ADVANCED PACKAGING  > Aptos expanding 12-inch WLP business...
  >  ADVANCED PACKAGING
Mar 14th, 2012
 
Aptos expanding 12-inch WLP business
 
Aptos Technology, which specializes in backend services for the production of NAND flash chips and devices such as microSD cards, announced March 13 that two of its subsidiaries will merge and integrate their resources and technologies for efficiency reasons. The move will help Aptos expand its 12-inch wafer level packaging business, the company said.
Send to a friend

ADL Engineering, which provides packaging and testing services for analog and logic ICs with customers mainly fabless companies, will merge with wafer-level packaging house Advanced Chip Engineering (ACE). ADL will be the surviving company, with the merger to be effective on April 22.

Full article here.


 
More ADVANCED PACKAGING news

Apr 17th
Apr 17th
Apr 9th
Apr 9th
Apr 9th
 
©2007 Yole Developpement All rights reserved                  Disclaimer | Legal notice | To advertise
Yole Développement: Le Quartz, 75 cours Emile Zola, 69100 Villeurbanne, France. TEL: (33) 472 83 01 80 FAX: (33) 472 83 01 83 E-Mail: info @yole.fr