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May 30th, 2012
 
Are silicon interposers “luxury” solutions?
 
Cost insights into the very first 2.5D package with silicon interposers for high-end digital applications.
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A lot has been said and written about the performance improvements offered by Xilinx’s Virtex-7 2000 FPGA series, which is built around the new "Stacked Silicon Interconnect Technology– SSIT". Detailed accounts of its unequaled FPGA computing bandwidth and low power consumption performance have been  published by Xilinx over the past 18 months.  As Xilinx is currently sampling these devices to its customers, we at Yole Développement thought this would be a good time to provide the readers of 3D Packaging with some cost insights concerning the very fi rst 2.5D package with silicon interposers for high-end digital applications. 

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