At ISSCC, National Chaio Tung University, China Medical University and Advanced Semiconductor Engineering (ASE) described a brain neural sensing microsystem based on a 3D-like device using through-silicon vias (TSVs).

Based on a 0.18-micron process, the chip measures 5 x 5 mm square. A MEMS neural microprobe array and a low-power CMOS readout circuit are fabricated on two sides of the same substrate.

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