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Feb 27th, 2013
 
Brain sensor using 3DIC demonstrated by National Chaio Tung University, China Medical University and ASE
 
At ISSCC, National Chaio Tung University, China Medical University and Advanced Semiconductor Engineering (ASE) described a brain neural sensing microsystem based on a 3D-like device using through-silicon vias (TSVs).
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Based on a 0.18-micron process, the chip measures 5 x 5 mm square. A MEMS neural microprobe array and a low-power CMOS readout circuit are fabricated on two sides of the same substrate.

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