Brewer Science, Inc., the inventor of ZoneBOND™ technology and world leading expert in materials and processes for thin wafer handling, and SUSS MicroTec, a leading supplier of equipment, are joining forces in commercializing ZoneBOND™ technology for thin wafer handling.

SUSS MicroTec, market leader in room temperature debonding process equipment, is now offering the Brewer Science ZoneBOND™ process on the XBC300 and XBS300 platforms, targeted for high volume bonding and debonding of 200/300mm wafers using silicon or glass carriers.

Brewer Science offers products specifically designed for the successful implementation of the ZoneBOND™ process including materials for carrier preparation, adhesives, removers, as well as small scale debonding equipment.

ZoneBOND™ technology is a break-through solution for wafer handling that provides excellent total thickness variation (TTV) control, high-temperature stability, and low-stress debonding. Customers will benefit through higher yield at debonding, higher throughput, and lower cost of ownership.

This joint effort combines both companies’ expertise to provide a complete material, equipment and process solution, optimized for each individual customer’s process needs.