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Dec 5th, 2011
Brewer Science and SUSS MicroTec jointly commercialize ZoneBOND™ technology for thin wafer handling
Brewer Science, Inc., the inventor of ZoneBOND™ technology and world leading expert in materials and processes for thin wafer handling, and SUSS MicroTec, a leading supplier of equipment, are joining forces in commercializing ZoneBOND™ technology for thin wafer handling.
SUSS MicroTec, market leader in room temperature debonding process equipment, is now offering the Brewer Science ZoneBOND™ process on the XBC300 and XBS300 platforms, targeted for high volume bonding and debonding of 200/300mm wafers using silicon or glass carriers.
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