webleads-tracker

Home  >  ADVANCED PACKAGING  > Brewer Science unveils Apogee™ temporary wafer bonder at CS ...
  >  ADVANCED PACKAGING
May 21st, 2014
 
Brewer Science unveils Apogee™ temporary wafer bonder at CS MANTECH
 
Brewer Science, Inc., a leading supplier of thin-wafer handling technology, materials, and equipment to the microelectronics industry,unveiled the Brewer Science® Apogee™ bonder for temporary wafer bonding applications.
Send to a friend
Brewer Science Apogee.
Brewer Science Apogee.

This marks an industry milestone in leveraging Brewer Science’s unique ability to combine processing equipment, high-temperature temporary adhesives, and process integration into a seamless thin-wafer handling solution.

The Apogee™ bonder supports multiple temporary bonding/debonding technologies including thermal slide, mechanical peel, and laser release debonding. The Apogee™ bonder completes the Brewer Science thin wafer handling tool suite for low-volume compound semiconductor production of RF filters, analog power devices, LEDs, and solar devices.  This collection of tools provides reduced time to market for ultrathin wafer technologies using Brewer Science’s integrated material and process solutions.

Brewer Science Equipment.

The Brewer Science® Apogee™ bonder delivers exceptional accuracy, interface capabilities, and process flexibility. Industry-leading features include:

  • Substrate size range of 50-300 mm
  • Dual rigid platens heat wafer stack from both sides, minimizing thermal defects
  • Ultraflat self-leveling platens minimize total thickness variation (TTV)
  • Evacuated bond chamber eliminates voids
  • Carrier and device are separated during pre-bond evacuation
  • Total thickness variation: <10%
  • Real-time access and control to process data and push notifications

Brewer Science processing equipment allows customers to cost-effectively enter new areas of product development and low-volume manufacturing. The equipment product suite can be used to develop process technologies for compound semiconductor, ultrathin CMOS, and MEMS manufacturing as well as thin films, sensors, and advanced packaging. The compact footprint, intuitive design, durability, and experience add up to years of high-performance processing that makes this tool suite perfect for low-volume production or R&D lab environments.


 
More ADVANCED PACKAGING news

Aug 12th
Aug 12th
Aug 11th
Aug 8th
Aug 6th
 
©2007 Yole Developpement All rights reserved                  Disclaimer | Legal notice | To advertise
Yole Développement: Le Quartz, 75 cours Emile Zola, 69100 Villeurbanne, France. TEL: (33) 472 83 01 80 FAX: (33) 472 83 01 83 E-Mail: info @yole.fr