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May 21st, 2014
Brewer Science unveils Apogee™ temporary wafer bonder at CS MANTECH
Brewer Science, Inc., a leading supplier of thin-wafer handling technology, materials, and equipment to the microelectronics industry,unveiled the Brewer Science® Apogee™ bonder for temporary wafer bonding applications.
This marks an industry milestone in leveraging Brewer Science’s unique ability to combine processing equipment, high-temperature temporary adhesives, and process integration into a seamless thin-wafer handling solution.
Brewer Science processing equipment allows customers to cost-effectively enter new areas of product development and low-volume manufacturing. The equipment product suite can be used to develop process technologies for compound semiconductor, ultrathin CMOS, and MEMS manufacturing as well as thin films, sensors, and advanced packaging. The compact footprint, intuitive design, durability, and experience add up to years of high-performance processing that makes this tool suite perfect for low-volume production or R&D lab environments.
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