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Jan 27th, 2014
BroadPak introduces semiconductor industry's first universally configurable 2.5D/3D silicon interposer platform that simultaneously develops prototypes and production-ready solutions
Single platform fits all applications, eliminates set-up time and tooling costs, and cuts prototype development time from 12 weeks to 10 Days.
BroadPak, the leading provider of 2.5D/3D integration technologies, comprehensive design and development services, and innovative total solutions used to enable and accelerate the development of 2.5D/3D electronic systems, announced the immediate availability of semiconductor industry's first universally configurable 2.5D/3D silicon interposer platform that can be used simultaneously for prototyping and high-volume production. This new technology enables companies to have access to fully customized 2.5D/3D silicon interposer in just 10 days with option of immediate release to high-volume manufacturing. This accelerates customer’s Time to Market (TTM) and reduces development costs by eliminating the set-up time and tooling costs. In addition, not only the prototype development time for conventional silicon interposer is cut from 12 weeks to 10 days, the resulting prototype solution is robust and fully optimized for immediate release to high-volume manufacturing.
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