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Jan 27th, 2014
BroadPak introduces semiconductor industry's first universally configurable 2.5D/3D silicon interposer platform that simultaneously develops prototypes and production-ready solutions
Single platform fits all applications, eliminates set-up time and tooling costs, and cuts prototype development time from 12 weeks to 10 Days.
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BroadPak, the leading provider of 2.5D/3D integration technologies, comprehensive design and development services, and innovative total solutions used to enable and accelerate the development of 2.5D/3D electronic systems, announced the immediate availability of semiconductor industry's first universally configurable 2.5D/3D silicon interposer platform that can be used simultaneously for prototyping and high-volume production. This new technology enables companies to have access to fully customized 2.5D/3D silicon interposer in just 10 days with option of immediate release to high-volume manufacturing. This accelerates customer’s Time to Market (TTM) and reduces development costs by eliminating the set-up time and tooling costs. In addition, not only the prototype development time for conventional silicon interposer is cut from 12 weeks to 10 days, the resulting prototype solution is robust and fully optimized for immediate release to high-volume manufacturing.

An innovative technology breakthrough by BroadPak has created this new silicon interposer platform which can support the development of diverse new semiconductor products with any chip size, technology node, package size, and netlist. This new interposer platform provides a low-cost path for 2.5D/3D memory and logic integration that has been verified for quality, reliability, and mass production. This configurable solution addresses the industry challenges including lengthy and costly prototype development, performance, integration, and IP development. Also, it eliminates the need for design PDKs and overcomes the reliability and supply chain bottlenecks. The new interposer platform serves a broad spectrum of applications such as power, mixed signal, networking, consumer, microcontroller, and embedded processor-based applications.

"Our customers need and demand a new rapid chip development process that can deliver faster Time to Market, higher performance, and more cost-effective solutions," said Farhang Yazdani, President and CEO of BroadPak. “In response to customer requirements, we developed our latest generation of silicon interposer platform which can be used to integrate any existing or new chip designs. This technology has already been field-tested, proven, and ready for full deployment. In addition, we have created a robust supply chain ecosystem that is flexible and can serve various applications and customer requirement from prototype to high-volume production. This new universal platform will accelerate the launch of 2.5D/3D products across the semiconductor industry".



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