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May 10th, 2012
Carsem to propose full turn-key manufacturing services for LED interposer assembly and test
Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced that they are now entering a partnership with a key customer to assemble and further develop LED packaging technologies.
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Carsem has successfully assembled and qualified High Brightness Silicon Substrate LED Arrays and will begin offering high-volume, full turn-key manufacturing services, including electrical testing, laser mark and tape-and-reel, in early 2012. The manufacturing process fully utilizes the advantage of standard mass production process of assembly and test including matrix substrate design; auto die attach, wire bond and high reflection coating dispense; compression molding through automold system; mapping of units on substrate and bin sort per test mapping.

This Silicon Substrate LED Array offers higher white light brightness with much less energy required (>50 lumens/watt). The life expectancy of the product is estimated at 10 years. General applications can be home use, cars, special light effect, etc.

Albert Law, Carsem’s V.P. of World Wide Sales and Marketing stated, “Because of our extensive experience in providing turnkey solutions, we are able to share our expertise with our LED customers and assist them in getting their products to market faster with turnkey solution on high density and high volume packaging, Carsem is expanding the company’s portfolio to include LED packaging solutions for the High Brightness LED applications.”

Carsem’s Chief Technology Officer, L.W. Yong stated, “By capitalizing on our extensive semiconductor experience in materials, process & equipment we have successfully advanced into the LED arena and thereby enhancing the manufacturability and efficiency of High Brightness LED.”



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