To download the latest issue
May 10th, 2012
Carsem to propose full turn-key manufacturing services for LED interposer assembly and test
Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced that they are now entering a partnership with a key customer to assemble and further develop LED packaging technologies.
Carsem has successfully assembled and qualified High Brightness Silicon Substrate LED Arrays and will begin offering high-volume, full turn-key manufacturing services, including electrical testing, laser mark and tape-and-reel, in early 2012. The manufacturing process fully utilizes the advantage of standard mass production process of assembly and test including matrix substrate design; auto die attach, wire bond and high reflection coating dispense; compression molding through automold system; mapping of units on substrate and bin sort per test mapping.
More ADVANCED PACKAGING news