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Sep 17th, 2013
Celebrating 10th year of 3D Architectures for Semiconductor Integration and Packaging
Three days with an outstanding cross-section of leaders in the 3D industry. Join us and gain insight into emerging trends.
Now celebrating its 10th year, 3D Architectures for Semiconductor Integration and Packaging continues to be an outstanding venue to meet with leaders from around the world to learn and discuss the latest technology and market insights into 2.5/3D device and systems integration and packaging.
Since the first conference that took place a decade ago, the 2.5/3D community and technology have progressed considerably. Yet today there are still many questions remaining on where the industry will be 10 years from now, what market applications will lead the way, and how each company can best compete in the emerging 2.5/3D device and system interconnect world. No doubt there are remaining technical and cost challenges, and even delays in expected market progress, but the basic drivers remain – investment in latest-node fabs is costly, and the idea that Moore’s Law will hit a wall somewhere in the not-too-distant future is often stated. The potential opportunities for the companies that can develop technology solutions and identify ways to collaborate and position themselves in the evolving value chain to leverage this technology are significant.
This meeting is firmly established as a leading industry event in 3D integration and packaging and serves the needs of the entire 3D ecosystem. The format of the conference enables speakers to present the most up-to-date and forthright perspectives possible, and provides exceptional opportunities to network with other participants.
3D Architectures for Semiconductor Integration and Packaging targets senior level technologists and business leaders from the world’s foremost companies and research institutions, and addresses the interests of a diverse group.
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