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Home  >  ADVANCED PACKAGING  > Chipbond lands 8-inch gold bumping orders from Samsung...
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Jun 6th, 2012
 
Chipbond lands 8-inch gold bumping orders from Samsung
 
LCD driver IC packaging and testing specialist Chipbond Technology reportedly has landed orders for 8-inch gold bumping from Samsung Electronics with shipments to begin in the third quarter of 2012, according to a Chinese-language Commercial Times report.
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Although the initial orders from Samsung are relatively small, the new orders will help Chipbond raise the utilization rate of its 8-inch gold bumping capacity as well as its profitability, noted the paper.

Full article here.


 
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